AI sustainable and efficient computing! ITRI and Japanese startup ZYRQ develop the world s first water immersion cooling technology
With the rapid development of High Performance Computing (HPC) and generative AI, the demand for heat dissipation in data centers and semiconductor chips continues to rise. ITRI today announced that it is cooperating with Japanese startup ZYRQ to jointly develop a new generation of "water immersion cooling technology" with the core goals of environmental protection, energy saving and high efficiency to solve the heat dissipation bottleneck caused by the high power consumption of AI chips.
ZYRQ was founded by the technical team of PEZY Computing, a Japanese supercomputer processor manufacturer. It masters Japan's high-performance computing application channels and system integration capabilities, and is an important strategic partner for Taiwanese technology to enter the Japanese semiconductor supply chain. It demonstrates Taiwan's innovative strength in the field of high-performance and green computing and opens a new milestone for both parties in cross-border collaboration.
Yang Bingxiang, deputy director of the Institute of Mechanical and Electromechanical Systems of ITRI, said that the biggest innovation of the world's first "water immersion cooling technology" is that it uses water as the cooling medium for the first time. Compared with oils or fluorides commonly used in the industry, water is not only non-toxic and zero-pollution, but also has the potential of zero carbon emissions. It has the advantage of being completely recycled and reused, showing a high degree of sustainability and environmental protection value.
Yang Bingxiang pointed out that through special heat dissipation component design, fluid formula, and system optimization and integration, the energy consumption required for heat dissipation can be effectively reduced, and the goal of "using less electricity and generating more computing power" can be successfully achieved. It not only significantly reduces the data center's dependence on power and cooling equipment, but also effectively reduces operating costs. It is an indicator of breakthrough significance in responding to the rapidly growing computing demand in the AI era.
Dai Nagai, President of Japan's ZYRQ, said that based on the research results of Pezy Computing, a Japanese high-performance computing manufacturer, in the field of liquid immersion cooling, ZYRQ developed an underground water cooling solution through technical cooperation with ITRI. This technology has helped supercomputer systems rank among the global "TOP500" rankings. In the future, ZYRQ is expected to fill the key gap in heat dissipation technology in Japan's Kyushu semiconductor industry chain.
Faced with the challenges of high heat and energy consumption brought by generative AI and cloud applications, ZYRQ turned to a water-centered immersion cooling system. Through ITRI's heat dissipation component design and fluid formula, and three joint tests with ITRI in Japan, it was confirmed that the system can effectively control the GPU surface temperature below 30°C and support 200 kilowatts of thermal power per cubic meter.
ITRI designs and uses metal 3D printing cooling plate technology to effectively reduce the use of copper materials and reduce the weight of equipment, which can further improve energy efficiency and system construction flexibility. Preliminary tests have been able to maintain 99.9% stable chip computing performance. The cooling efficiency is more than twice that of the current liquid cooling system, and the power usage efficiency (PUE) is reduced to 1.015. Compared with the existing cooling system, the construction cost can be significantly reduced.
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